Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation - Yongle Wu - Books - Springer Verlag, Singapore - 9789819914579 - June 3, 2024
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Yongle Wu
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation 2023 edition

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This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases.

311 pages, 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illu

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 3, 2024
ISBN13 9789819914579
Publishers Springer Verlag, Singapore
Pages 311
Dimensions 150 × 220 × 10 mm   ·   499 g

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