Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation - Yongle Wu - Books - Springer Verlag, Singapore - 9789819914548 - June 2, 2023
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Yongle Wu
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation 2023 edition

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This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases.

311 pages, 7 Illustrations, color; 686 Illustrations, black and white; XV, 311 p. 693 illus., 7 illu

Media Books     Hardcover Book   (Book with hard spine and cover)
Released June 2, 2023
ISBN13 9789819914548
Publishers Springer Verlag, Singapore
Pages 311
Dimensions 150 × 220 × 20 mm   ·   635 g

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