Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics - Tong, Xingcun Colin, Ph.D. - Books - Springer-Verlag New York Inc. - 9781461427926 - February 25, 2013
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Tong, Xingcun Colin, Ph.D.
Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics 2011 edition

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.

550 pages, 26 black & white tables, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 25, 2013
ISBN13 9781461427926
Publishers Springer-Verlag New York Inc.
Pages 618
Dimensions 236 × 243 × 31 mm   ·   884 g
Language English  

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