Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics - Tong, Xingcun Colin, Ph.D. - Books - Springer-Verlag New York Inc. - 9781441977588 - January 10, 2011
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Tong, Xingcun Colin, Ph.D.
Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics 2011 edition

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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance.

550 pages, 26 black & white tables

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 10, 2011
ISBN13 9781441977588
Publishers Springer-Verlag New York Inc.
Pages 618
Dimensions 159 × 242 × 53 mm   ·   1.10 kg
Language English  

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