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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages Gerard Kelly Softcover Reprint of the Original 1st Ed. 1999 edition
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages
Gerard Kelly
153 pages, black & white illustrations, bibliography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | October 8, 2012 |
| ISBN13 | 9781461372769 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 134 |
| Dimensions | 155 × 235 × 9 mm · 235 g |
| Language | English |
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