Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Suhir, Ephraim (Portland State University, Portland, USA) - Books - Taylor & Francis Ltd - 9781138624733 - January 28, 2021
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Suhir, Ephraim (Portland State University, Portland, USA)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices 1st edition

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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

344 pages, 49 Tables, black and white; 75 Illustrations, black and white

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 28, 2021
ISBN13 9781138624733
Publishers Taylor & Francis Ltd
Pages 382
Dimensions 241 × 167 × 31 mm   ·   754 g
Language English  

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