Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices - Suhir, Ephraim (Portland State University, Portland, USA) - Books - Taylor & Francis Ltd - 9780367635886 - October 4, 2024
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Suhir, Ephraim (Portland State University, Portland, USA)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

382 pages, 49 Tables, black and white; 75 Illustrations, black and white

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 4, 2024
ISBN13 9780367635886
Publishers Taylor & Francis Ltd
Pages 382
Dimensions 150 × 220 × 10 mm   ·   453 g
Language English  

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