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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam - Springer Proceedings in Physics
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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam - Springer Proceedings in Physics
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology.
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | March 12, 2025 |
| ISBN13 | 9789819628704 |
| Publishers | Springer Nature Switzerland AG |
| Pages | 421 |
| Dimensions | 150 × 220 × 20 mm · 894 g |
| Editor | Abdul Razak, Kamrosni |
| Editor | Abdul Razak, Nurul Razliana |
| Editor | Baser, Muhammad Fadlin Hazim |
| Editor | Che Halin, Dewi Suriyani |
| Editor | Mohd Salleh, Mohd Arif Anuar |
| Editor | Somidin, Flora |
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