Electrical Design of Through Silicon Via - Manho Lee - Books - Springer - 9789401790376 - May 20, 2014
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Manho Lee
Electrical Design of Through Silicon Via 2014 edition

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This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.

289 pages, 249 black & white illustrations, 249 colour tables, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released May 20, 2014
ISBN13 9789401790376
Publishers Springer
Pages 280
Dimensions 162 × 240 × 20 mm   ·   585 g
Editor Kim, Joungho
Editor Lee, Manho
Editor Pak, Jun So

Mere med samme udgiver

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