Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science - Michael R Oliver - Books - Springer-Verlag Berlin and Heidelberg Gm - 9783540431817 - January 26, 2004
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Michael R Oliver
Chemical-Mechanical Planarization of Semiconductor Materials - Springer Series in Materials Science 2004 edition

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

428 pages, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 26, 2004
ISBN13 9783540431817
Publishers Springer-Verlag Berlin and Heidelberg Gm
Pages 428
Dimensions 155 × 235 × 26 mm   ·   793 g
Language French  
Editor Oliver, M.R.

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