Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications - - Books - Springer International Publishing AG - 9783319186740 - December 16, 2015
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications 1st ed. 2015 edition

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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.

408 pages, 191 black & white illustrations, 269 colour illustrations, 35 black & white tables, biogr

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 16, 2015
ISBN13 9783319186740
Publishers Springer International Publishing AG
Pages 408
Dimensions 155 × 235 × 24 mm   ·   775 g
Language French  
Editor Kada, Morihiro
Editor Kondo, Kazuo
Editor Takahashi, Kenji

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