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Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications: Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3 - Lecture Notes in Electrical Engineering
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Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications: Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3 - Lecture Notes in Electrical Engineering
This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025.
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | March 27, 2026 |
| ISBN13 | 9783032203175 |
| Publishers | Springer Nature Switzerland AG |
| Pages | 567 |
| Dimensions | 150 × 220 × 20 mm · 993 g |
| Language | German |
| Editor | Bhateja, Vikrant |
| Editor | Omar, Zaid |
| Editor | Pham, Hai Van |
| Editor | Yang, Xin-She |
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