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Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity Zengtao Chen 2020 edition
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Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity
Zengtao Chen
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | September 19, 2020 |
| ISBN13 | 9783030252038 |
| Publishers | Springer Nature Switzerland AG |
| Pages | 304 |
| Dimensions | 150 × 220 × 10 mm · 444 g |
| Language | German |
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