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China and America’s Tech War from AI to 5G: The Struggle to Shape the Future of World Order A. B. Abrams
China and America’s Tech War from AI to 5G: The Struggle to Shape the Future of World Order
A. B. Abrams
Assessing key areas of Sino-U. S. technological competition such as artificial intelligence, quantum computing, telecommunications, green tech and defense, the ability of both countries’ industries and tech sectors to compete, and the likely consequences primacy in each area will have.
432 pages
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | February 26, 2024 |
| ISBN13 | 9781666912425 |
| Publishers | Bloomsbury Publishing Plc |
| Pages | 432 |
| Dimensions | 153 × 228 × 27 mm · 616 g |
| Language | English |