Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability - Tae-Kyu Lee - Books - Springer-Verlag New York Inc. - 9781489978011 - October 1, 2016
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Tae-Kyu Lee
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability Softcover reprint of the original 1st ed. 2015 edition

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.

266 pages, 70 black & white illustrations, 81 colour illustrations, 18 black & white tables, biograp

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 1, 2016
ISBN13 9781489978011
Publishers Springer-Verlag New York Inc.
Pages 253
Dimensions 150 × 220 × 10 mm   ·   508 g   (Weight (estimated))
Language English  

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