Thermal Stress and Strain in Microelectronics Packaging - John Lau - Books - Springer-Verlag New York Inc. - 9781468477696 - April 30, 2012
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John Lau
Thermal Stress and Strain in Microelectronics Packaging Softcover reprint of the original 1st ed. 1993 edition

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Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications.

884 pages, 466 black & white illustrations

Media Books     Paperback Book   (Book with soft cover and glued back)
Released April 30, 2012
ISBN13 9781468477696
Publishers Springer-Verlag New York Inc.
Pages 884
Dimensions 152 × 229 × 45 mm   ·   1.19 kg
Language English  
Editor Lau, John

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