Packaging of High Power Semiconductor Lasers - Micro- and Opto-Electronic Materials, Structures, and Systems - Xingsheng Liu - Books - Springer-Verlag New York Inc. - 9781461492627 - July 15, 2014
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Xingsheng Liu
Packaging of High Power Semiconductor Lasers - Micro- and Opto-Electronic Materials, Structures, and Systems 2015 edition

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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

417 pages, 111 black & white illustrations, 386 colour illustrations, 27 black & white tables, biogr

Media Books     Hardcover Book   (Book with hard spine and cover)
Released July 15, 2014
ISBN13 9781461492627
Publishers Springer-Verlag New York Inc.
Pages 402
Dimensions 159 × 242 × 22 mm   ·   732 g
Language English  

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