Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology - Kazuo Kondo - Books - Springer-Verlag New York Inc. - 9781461491750 - November 21, 2013
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Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology 2014 edition

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Expected to be ready for shipping Jul 20 - 24
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In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes.


298 pages, 115 black & white illustrations, 75 colour illustrations, 12 black & white tables, biogra

Media Books     Hardcover Book   (Book with hard spine and cover)
Released November 21, 2013
ISBN13 9781461491750
Publishers Springer-Verlag New York Inc.
Pages 282
Dimensions 155 × 235 × 18 mm   ·   585 g
Language English  
Editor Akolkar, Rohan N.
Editor Barkey, Dale P.
Editor Kondo, Kazuo
Editor Yokoi, Masayuki

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