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High-frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects Luc Martens Softcover Reprint of the Original 1st Ed. 1998 edition
High-frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects
Luc Martens
170 pages, biography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | February 23, 2014 |
| ISBN13 | 9781461375739 |
| Publishers | Springer-Verlag New York Inc. |
| Pages | 170 |
| Dimensions | 155 × 235 × 10 mm · 258 g |
| Language | English |