High-frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects - Luc Martens - Books - Springer-Verlag New York Inc. - 9781461375739 - February 23, 2014
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High-frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects Softcover Reprint of the Original 1st Ed. 1998 edition

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170 pages, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 23, 2014
ISBN13 9781461375739
Publishers Springer-Verlag New York Inc.
Pages 170
Dimensions 155 × 235 × 10 mm   ·   258 g
Language English  

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