Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging - John W Balde - Books - Springer-Verlag New York Inc. - 9781461349778 - February 23, 2014
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John W Balde
Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging Softcover reprint of the original 1st ed. 2003 edition

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

366 pages, 266 black & white illustrations, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 23, 2014
ISBN13 9781461349778
Publishers Springer-Verlag New York Inc.
Pages 347
Dimensions 155 × 235 × 20 mm   ·   521 g
Language English  
Editor Balde, John W.

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