Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems - Chuan Seng Tan - Books - Springer-Verlag New York Inc. - 9781441945624 - December 8, 2010
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Chuan Seng Tan
Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems 1st ed. Softcover of orig. ed. 2009 edition

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.

376 pages, 25 black & white tables, biography

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 8, 2010
ISBN13 9781441945624
Publishers Springer-Verlag New York Inc.
Pages 410
Dimensions 155 × 235 × 19 mm   ·   526 g
Editor Gutmann, Ronald J.
Editor Reif, L. Rafael
Editor Tan, Chuan Seng

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