Stochastic Finite Element Modeling in Electronic Packaging - Chu, Liu (Tongji University, China) - Books - John Wiley & Sons Inc - 9781394352944 - January 12, 2026
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Chu, Liu (Tongji University, China)
Stochastic Finite Element Modeling in Electronic Packaging

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Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 12, 2026
ISBN13 9781394352944
Publishers John Wiley & Sons Inc
Pages 288
Dimensions 238 × 158 × 22 mm   ·   532 g
Language English  

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