Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press - B Keser - Books - John Wiley & Sons Inc - 9781119314134 - March 29, 2019
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B Keser
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies - IEEE Press

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576 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released March 29, 2019
ISBN13 9781119314134
Publishers John Wiley & Sons Inc
Pages 576
Dimensions 235 × 160 × 33 mm   ·   1.03 kg
Language English  
Editor Keser, Beth
Editor Kr¿hnert, Steffen

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