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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide Li (Li Yang), Suny
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SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide
Li (Li Yang), Suny
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow.
496 pages
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | July 24, 2017 |
| ISBN13 | 9781119045939 |
| Publishers | John Wiley & Sons Inc |
| Pages | 400 |
| Dimensions | 252 × 177 × 30 mm · 907 g |
| Language | English |
