Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613 - MRS Proceedings - - Books - Cambridge University Press - 9781107413146 - June 5, 2014
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Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613 - MRS Proceedings

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Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.

176 pages, black & white illustrations

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 5, 2014
ISBN13 9781107413146
Publishers Cambridge University Press
Pages 176
Dimensions 152 × 229 × 10 mm   ·   375 g   (Weight (estimated))
Language English  
Editor Bajaj, Rajeev
Editor Meuris, Marc
Editor Moinpour, Mansour
Editor Singh, Rajiv K. (University of Florida)

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