Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings - - Books - Cambridge University Press - 9781107408715 - June 5, 2014
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A. - MRS Proceedings

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This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.

358 pages, black & white illustrations

Media Books     Paperback Book   (Book with soft cover and glued back)
Released June 5, 2014
ISBN13 9781107408715
Publishers Cambridge University Press
Pages 358
Dimensions 152 × 229 × 19 mm   ·   568 g   (Weight (estimated))
Language English  
Editor Lin, Qinghuang (IBM T J Watson Research Center, New York)
Editor Ryan, E. Todd
Editor Wu, Wen-li (National Institute of Standards and Technology, Maryland)
Editor Yoon, Do Yeung (Seoul National University)

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