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Direct Copper Interconnection for Advanced Semiconductor Technology Dongkai Shangguan
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Direct Copper Interconnection for Advanced Semiconductor Technology
Dongkai Shangguan
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
250 pages, 21 Tables, black and white; 378 Line drawings, black and white; 20 Halftones, black and w
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | June 28, 2024 |
| ISBN13 | 9781032528236 |
| Publishers | Taylor & Francis Ltd |
| Pages | 448 |
| Dimensions | 243 × 163 × 33 mm · 836 g |
| Language | English |
| Editor | Shangguan, Dongkai |
