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Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021) Asme
Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021)
Asme
Explores the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. Presents 76 papers from the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
648 pages
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | May 30, 2022 |
| ISBN13 | 9780791885505 |
| Publishers | American Society of Mechanical Engineers |
| Pages | 648 |
| Dimensions | 278 × 347 × 41 mm · 1.21 kg |
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