Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018) - Asme - Books - American Society of Mechanical Engineers - 9780791851920 - November 30, 2019
In case cover and title do not match, the title is correct

Asme
Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

Get an email once the item is available
Do you have a profile? Log in

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

A printed collection of 62 full-length, peer-reviewed technical papers. Topics include Heterogeneous Integration: Micro-Systems With Diverse Functionality; Servers of the Future, IoT, and Edge to Cloud; Structural and Physical Health Monitoring; Power Electronics, Energy Conversion, and Storage; and Autonomous, Hybrid, and Electric Vehicles.

558 pages

Media Books     Paperback Book   (Book with soft cover and glued back)
Released November 30, 2019
ISBN13 9780791851920
Publishers American Society of Mechanical Engineers
Pages 558
Dimensions 150 × 220 × 10 mm   ·   924 g   (Weight (estimated))

More by Asme

Show all

Mere med samme udgiver

See all of Asme ( e.g. Paperback Book , Book and Hardcover Book )